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5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity

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5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity

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Brand Name : HUITIAN

Model Number : 5280

Certification : RoHS REACH

Place of Origin : CHINA

MOQ : 200 kg

Price : Negotiation

Payment Terms : L/C,T/T

Supply Ability : 2000T/Month

Delivery Time : 5-8 days

Packaging Details : 20kg/barrel

Physical Form : Paste

Color Part A : Gray fluid

Color Part B : White fluid

Viscosity Part A : 2,000~3,500 mPa·s

Viscosity Part B : 2,000~3,500 mPa·s

Mixing Ratio : 1:1

Opearting Time @25 °C : 60-240 mins

Curing Time @80℃ : ≤30 mins

Hardness : 10~30 Shore A

Volume resistivity : 1.0*10^12 Ω∙cm

Dielectric strength : ≥14 KV/mm

Thermal Conductivity : ≥0.6 W/(m•K)

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Product Description

5280 Potting Compound is a high-performance, two-part addition-type silicone rubber designed specifically for the electronics industry. This gray, high thermal conductive compound offers exceptional insulation properties, flame retardancy, and mechanical stability over a wide temperature range. It is ideal for protecting sensitive electronic components from environmental hazards while ensuring long-term reliability and performance.


Product Applications

The 5280CA9/5280CB9 Potting Compound is widely used in various electronic applications, including:
  • Module Power Supplies: Provides moistureproofing and insulation to protect against short circuits and corrosion.
  • LED Drive Power Supplies: Ensures thermal management and mechanical stability, prolonging the lifespan of LED components.
  • Network Transformers: Offers excellent insulation and anti-fouling properties to maintain signal integrity.
  • Reversing Radars: Protects sensitive radar components from moisture and physical shock, ensuring reliable operation.
  • General Electronics: Suitable for a wide range of electronic components, providing comprehensive protection against moisture, dust, corrosion, and mechanical shock.


Key Product Features

  • High Thermal Conductivity: With a thermal conductivity of ≥0.6 W/m·K, the compound efficiently dissipates heat, ensuring optimal performance of electronic components.
  • UL94V-0 Flame Retardant: Meets stringent safety standards, providing excellent fire resistance and reducing the risk of electrical fires.
  • Excellent Insulation: Features a dielectric strength of ≥14 KV/mm, ensuring reliable electrical insulation and preventing short circuits.
  • Wide Temperature Range: Maintains rubber elasticity from -50°C to 200°C, ensuring consistent performance in extreme conditions.
  • RoHS Compliant: Environmentally friendly and compliant with the Restriction of Hazardous Substances Directive, making it suitable for use in a wide range of applications.
  • Ease of Use: 1:1 mix ratio simplifies the application process, ensuring consistent performance and reducing the risk of errors.


Technical Parameters

Parameter Value
Physical Properties Before Curing (25±2℃, 60%±5%RH)
Appearance (A) Gray flow
Appearance (B) White flow
Viscosity (A) 2,000~3,500 mPa·s
Viscosity (B) 2,000~3,500 mPa·s
Curing Properties (A:B=1:1)
Operating Time (25℃) 60~240 min
Curing Time (85℃) ≤30 min
Physical Properties After Curing (25±2℃, 60±5%RH, A:B=1:1)
Density 1.70~1.9 g/cm³
Hardness 10~30 Shore A
Shear Strength (PCB) 0.3-0.8 MPa
Thermal Conductivity ≥0.6 W/m·K
Dielectric Strength ≥14 KV/mm
Volume Resistivity ≥1.0×10¹² Ω·cm


Directions for Use

Preparation

  • Stirring: Fully stir part A and part B separately, either manually or mechanically, to ensure homogeneity and avoid performance changes due to filler settlement.

Mixing

  • Weighing: Accurately weigh the two parts into a clean container by weight ratio (1:1) and stir well to ensure thorough mixing.

Defoaming

  • Natural Defoaming: Allow 20-30 minutes for natural defoaming after filling the mixed glue into the components.
  • Vacuum Defoaming: For faster defoaming, pot the components after pumping for 5-10 minutes at a vacuum degree of 0.08-0.1 MPa.

Potting

  • Surface Preparation: Ensure the surfaces to be potted are clean and dry. Apply the glue while it still has good flowability to achieve optimal leveling.

Curing

  • Curing Conditions: The glue can cure at room temperature or by heating. Higher temperatures accelerate curing, and heat curing is recommended in colder conditions (e.g., winter).


Packaging & Storage Conditions
Packaging:

  • 5280CA9 (20 kg/barrel), 5280CB9 (20 kg/barrel)
  • Storage: Store at room temperature in a cool and dry place. The shelf life is 6 months.


5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity

5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity

5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity


Product Tags:

gray silicone potting compound

      

high thermal conductivity potting compound

      

electronics silicone potting compound

      
Quality 5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity for sale

5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity Images

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